바로가기 메뉴
본문 바로가기
푸터 바로가기
TOP

High-entropy alloy foam and manufacturing method for the foam

International

High-entropy alloy foam and manufacturing method for the foam

Name of Country in which applied

USA

Persons Registered

E.S. Park, K.N. Yoon, K. Yaqoob, J.I. Lee, J.Y. Kim

Application Number (date)

USA, US 15/414,778 (Jan. 25 2017)

Registration Number (date)

US 10,941,463 B2, (Mar. 9 2021)

Link

  • “High-entropy alloy foam and manufacturing method for the foam”
    Name of Country in which applied: USA
    Persons Registered: E.S. Park, K.N. Yoon, K. Yaqoob, J.I. Lee, J.Y. Kim
    Application Number (date): USA, US 15/414,778 (Jan. 25 2017)
    Registration Number (date): US 10,941,463 B2, (Mar. 9 2021)