- “High-entropy alloy foam and manufacturing method for the foam”
Name of Country in which applied: USA
Persons Registered: E.S. Park, K.N. Yoon, K. Yaqoob, J.I. Lee, J.Y. Kim
Application Number (date): USA, US 15/414,778 (Jan. 25 2017)
Registration Number (date): US 10,941,463 B2, (Mar. 9 2021)