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Complex copper alloy including high-entropy alloy and method of manufacturing same

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Complex copper alloy including high-entropy alloy and method of manufacturing same

Name of Country in which applied

USA

Persons Registered

E.S. Park, K.N. Yoon, J.Y. Kim, J.W. Yeh

Application Number (date)

USA, US 17/286,942 (Oct. 22 2019)

Registration Number (date)

US 11,807,927 B2, (Nov. 7 2023)

Link

  • “Complex copper alloy including high-entropy alloy and method of manufacturing same”
    Name of Country in which applied: USA
    Persons Registered: E.S. Park, K.N. Yoon, J.Y. Kim, J.W. Yeh
    Application Number (date): USA, US 17/286,942 (Oct. 22 2019)
    Registration Number (date): US 11,807,927 B2, (Nov. 7 2023)
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